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Case Number Employer Name Job Title Base Salary Submit Date Decision Date Start Date City Location State Location
I-200-20029-283116 Micron Technology Inc. Engineer-Dry Etch-DRAM/EM $97,850 Per Year 01/29/2020 02/05/2020 07/21/2020 Boise ID
I-200-20063-371203 Micron Technology Inc. Engineer-DRY ETCH-DRAM/EM $95,000 Per Year 03/03/2020 03/10/2020 08/27/2020 Boise ID
I-200-20189-699230 Micron Technology Inc. Engineer-Dry Etch-DRAM/EM $109,232 Per Year 07/07/2020 07/14/2020 07/24/2020 BOISE ID
I-200-20189-699532 Micron Technology Inc. Engineer-Dry Etch-DRAM/EM $109,232 Per Year 07/07/2020 07/14/2020 07/24/2020 BOISE ID

This website indexes the Labor Condition Application (LCA) disclosure data from the United States Department of Labor (DOL).

Prior to filing an H-1B petition with the USCIS, an employer must file an LCA with the DOL.

An LCA is used by employers as supporting evidence for the petition for an H-1B visa.

DOL disclosure data does not indicate the employers intended use for the LCA.

This information is to be used only for information. There is a possibility where the information might not be accurate because the data files changes constantly.

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Indexed more than 5 million records between 2010 and 2021

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